Automated Red Gel Solder Paste Temperature Recovery Machine 8-Station 10-Station

I. Product performance and characteristics:

Second, the use of solder paste and requirements:

Before using the solder paste, when you take out the solder paste from the refrigerator, its temperature will be much lower than the room temperature. If the cap is opened without being warmed back up, thewater vapor in the air will easily condense and adhere to the solderpaste. After printing with this paste, in the re-soldering furnace (temperature over 200 ℃), the wateris subjected to intense heat and rapid vaporization, resulting in "burst tin" phenomenon, resulting in tin beads, and evendamage to components.In order to matchtheproductionof the soldering process, such as printing performance, anti-collapse performance, mold release performance, etc., the solder paste needs to be warmed up before use.

Currently, most factories use manual methods to manage the temperature return of solder paste: the solder paste to be used is placed on the table at the front of the printing machine, andthe operator manually records the temperature return time. This method is not only inefficient and wastes a lot of production time, but it is also often the case that operatorsuse paste that has not been fully rewarmed because theywant to maximize throughput. Or, due to different operators, the same product may use differentpaste with differentrewarming times, resulting in different soldering results.

Some operators take the paste out of the refrigerator and stir it immediately, thinking that the temperature will come up after stirring, and then use it on line, whichsometimes does not have any effectafter reflow soldering . Using solder paste that has not been warmed up and stirred directly may not be a problem,but when comparing the natural warming and stirring with the non-warmed up direct stirring of the solder paste, there will be adifference. Direct stirring can provide some warming back,but never completely. Maybe to the naked eye, the effect of reflow is not different, but in the x-ray you can find that there will be many bubbles,or is in the 3d microscope, the natural warming and stirring of the warming of the paste, you can also see a lot of differences.

Advantages of using solder paste rewarming machine:

After the mixer stirred, the viscosity will change, printing up the feeling of no change, so many people think there is no problem.But back to the temperature to solve thefluxof theactivityof theappropriate temperature, there is a difference between the two. Of course, the mixing will have a certain temperature increase, but not reach the requiredtemperature. Also, when you carefully observe thebubble situationofchip and bga , you will find that the cavitation rateis different.

1.The use of temperature return machine can better solve the problem of natural temperature return, can effectively assist in controlling the production program, improve production efficiency.

2. Only in the production of all aspects of the process are strictly controlled to ensure stable product quality.