SMT Fuji P/B SW A50451 AH165-TFY11

【XP243E Mains Power Switch

Product Name：XP243E Main Power Switch
English Name：P/B SW
Material No.: A50451
Use：XP243E

How to distinguish between SMT FUJI Fuji original parts and imitation parts:

Original:
Better material, wear-resistant, longer service life;
High precision, good mounting effect;
Smooth nozzle hole, not easy to block the hole;
Reflective effect is good, recognize the nozzle is more accurate.

Imitation:
Poor material, not wear-resistant, shorter service life;
Poor precision, which has an impact on the quality of the mounting;
Smaller suction nozzle holes, easy to plug the holes, resulting in insufficient vacuum, poor pick-up, throwing material serious;
Reflective effect is poor, recognition of the suction nozzle is easier to cause recognition errors.

Share smt common knowledge
1.Generally speaking, the temperature of SMT workshop is 25±3℃.
2.SMT process is to feed the board system - solder paste printing machine - high-speed machine - general-purpose machine - the very current welding - the board receiving machine.
3.SMT PCB positioning methods are  vacuum positioning  mechanical hole positioning  bilateral clamp positioning and board edge positioning.
4.The purpose of PCB vacuum packaging is to prevent dust and moisture.
5.SMT manufacturing process  the main reasons for the generation of tin beads:PCB PAD design is poor, poor design of the steel plate aperture, the placement of pieces of depth or placement of pieces of pressure is too large, Profile curve slope is too large  solder paste collapse, paste viscosity is too low.
6.Solder paste printing, the materials and tools required to prepare the solder paste, steel plate  scraper  wiping paper, dust-free paper  cleaning agent  stirring knife.
7.Commonly used solder paste alloy composition for Sn / Pb alloy, and the alloy ratio of 63/37.
8.The composition of the solder paste contains  metal powder  solvent  flux  anti-sagging agent  active agent  by weight  metal powder accounted for 85-92% of  by volume. 92%  by volume of metal powder accounted for 50%  of which the main components of metal powder for tin and lead, the ratio of 63/37  melting point of 183 ℃; solder paste must be taken out of the refrigerator to return to the temperature, the purpose is to  let the temperature of the refrigerated solder paste back to room temperature  for printing. If you do not return to the temperature in the PCB  into the Reflow is prone to produce defective tin beads.
9.Process due to poor printing caused by short-circuit reasons a. paste metal content is not enough  cause collapse b. Stencil openings are too large  caused by too much tin c. poor quality of the stencil  under the tin bad  change the laser cutting templates d . Stencil backside residual solder paste  reduce squeegee pressure  use the appropriate VACCUM and SOLVENT
10.The main components of solder paste are divided into two main parts: tin powder and flux.