SMT Pick and Place Machine Nozzle XP143/142 0.7 1.0 1.3 1.8

1. The air pressure at the mouth of the suction nozzle is controlled at a relatively low level, which

The SMD components inside the suction nozzle are adsorbed to the mouth under the action of air pressure.

2、When the mounter detects the position of components to be mounted, it will start the vacuum

Suction nozzle, the use of vacuum pump generated by the negative pressure of the SMD components from the solder paste sucked up.

1.Transparent box

2.Nozzle black

The role of the bonder nozzle:

With the development of integrated circuits, the market chip volume miniaturization, high precision and

High technical requirements and high demand. People have been unable to meet the market requirements for mounting, automated mounter equipment began to replace manual labor.

Automated mounter equipment began to replace manual labor. The suction nozzle is a component on the mounter.

Components are the use of this suction nozzle, adsorption after moving to the designated location, the

When the mounter's suction nozzle sucks up the components, to achieve the ideal situation, it is necessary to ensure that the center of the components, the suction nozzle

The center of the component, the center of the suction nozzle and the center of the acquired image space should be coincident.

The center of the component, the center of the nozzle and the spatial center of the acquired image should be coincident.More effectively improve production efficiency, to meet market demand.

XP141 142 143 XPF Mounter Nozzle

0.4 0.7 1.0 1.3 1.8 2.5 3.7 5.0